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Chip Packaging Is the Next Battleground for Tech Lead, CEO Says

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Sept. 12, 2023, 9 a.m. | Jane Lee, Debby Wu

Bloomberg Technology bloomberg.com

The US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence, Cadence Design Systems Inc. Chief Executive Officer Anirudh Devgan said.

artificial artificial intelligence cadence ceo chip design design systems edge intelligence leads next packaging semiconductor systems tech technologies

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