April 3, 2024, 6:30 p.m. | Yoolim Lee, Mackenzie Hawkins

Bloomberg Technology bloomberg.com

SK Hynix Inc. plans to spend $3.87 billion building an advanced packaging plant and research center for artificial intelligence products in Indiana, marking a win for the Biden administration as it seeks to increase semiconductor output on American soil.

administration advanced advanced packaging artificial artificial intelligence biden biden administration billion building center chip intelligence ksc:000660 packaging products research semiconductor sk hynix spend

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