A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing. (arXiv:2206.07481v1 [eess.SP])

Web: http://arxiv.org/abs/2206.07481

Defect detection plays a vital role in the manufacturing process of
integrated circuits (ICs). Die attachment and wire bonding are two steps of the
manufacturing process that determine the quality and reliability of the power
and signal transmission in an IC. This paper presents a survey or literature
review of the methods used for detecting these defects based on different
sensing modalities used including optical, radiological, acoustical, and
infrared thermography. A discussion of the detection methods used is provided
in …

arxiv defects detection manufacturing survey