Oct. 5, 2023, 3:15 p.m. | PR Newswire

AI – AI-TechPark ai-techpark.com

New Single-Chip 800G PIC will be on Display at ECOC 2023 in Multiple Applications Including 800G DR8/DR8+, Immersion Cooling and Reduced-Reach Connectivity  DustPhotonics, a leading developer of silicon photonics technology and solutions for hyperscale data centers and AI applications, today announced the industry’s first merchant single-chip 800G DR8 PIC (Photonic...


The post DustPhotonics announced Merchant 800G Silicon Photonics Chip first appeared on AI-TechPark.

ai ai applications applications chip connectivity cooling data data centers developer hyperscale hyperscale data centers industry multiple photonics silicon silicon photonics solutions technology

Founding AI Engineer, Agents

@ Occam AI | New York

AI Engineer Intern, Agents

@ Occam AI | US

AI Research Scientist

@ Vara | Berlin, Germany and Remote

Data Architect

@ University of Texas at Austin | Austin, TX

Data ETL Engineer

@ University of Texas at Austin | Austin, TX

Lead GNSS Data Scientist

@ Lurra Systems | Melbourne