Sept. 18, 2023, 1 p.m. | Dean Takahashi

AI News | VentureBeat

Intel said it has made a significant breakthrough in the development of glass substrates for next-generation advanced packaging in an attempt to stay on the past of Moore’s Law. The big chip maker said this milestone achievement is set to redefine the boundaries of transistor scaling, enabling the realization of data-centric applications and propelling the […]

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