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Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires. (arXiv:2205.09065v1 [cs.LG])
May 19, 2022, 1:11 a.m. | Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen
cs.LG updates on arXiv.org arxiv.org
Electromigration (EM) is one of the major concerns in the reliability
analysis of very large scale integration (VLSI) systems due to the continuous
technology scaling. Accurately predicting the time-to-failure of integrated
circuits (IC) becomes increasingly important for modern IC design. However,
traditional methods are often not sufficiently accurate, leading to undesirable
over-design especially in advanced technology nodes. In this paper, we propose
an approach using multilayer perceptrons (MLP) to compute stress evolution in
the interconnect trees during the void nucleation …
More from arxiv.org / cs.LG updates on arXiv.org
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