Web: http://arxiv.org/abs/2208.04045

Aug. 10, 2022, 1:11 a.m. | Simon Baeuerle, Marius Gebhardt, Jonas Barth, Andreas Steimer, Ralf Mikut

cs.LG updates on arXiv.org arxiv.org

Thermal Interface Materials (TIMs) are widely used in electronic packaging.
Increasing power density and limited assembly space pose high demands on
thermal management. Large cooling surfaces need to be covered efficiently. When
joining the heatsink, previously dispensed TIM spreads over the cooling
surface. Recommendations on the dispensing pattern exist only for simple
surface geometries such as rectangles. For more complex geometries,
Computational Fluid Dynamics (CFD) simulations are used in combination with
manual experiments. While CFD simulations offer a high accuracy, …

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