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SK Hynix confirms plans to bring HBM manufacturing to the US
April 4, 2024, 7:50 p.m. | Shawn Knight
TechSpot www.techspot.com
As previously reported, the advanced packaging facility and research and development hub for artificial intelligence will be built in Indiana – in the city of West Lafayette, to be exact. The plant will turn out next generation, high-bandwidth memory, a core component in the creation of GPUs used to train...
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advanced advanced packaging artificial artificial intelligence bandwidth city core development facility gpus hbm hub intelligence manufacturing memory next packaging research research and development sk hynix west will
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