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SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech (Nikkei Asia)
April 20, 2024, 3:35 a.m. |
Techmeme www.techmeme.com
Nikkei Asia:
SK Hynix partners with TSMC to develop next-gen HBM4 chips, which are critical for AI and slated for mass production in 2026, and advanced chip packaging tech — Asian chipmakers aim to supply next-generation high-bandwidth memory for Nvidia — SEOUL/TAIPEI — SK Hynix …
advanced asia asian chip chips gen next next-gen packaging partners production sk hynix tech tsmc
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