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Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs (Financial Times)
Feb. 1, 2024, 10:50 a.m. |
Techmeme www.techmeme.com
Financial Times:
Sources: SK Hynix plans to build an advanced chip packaging plant in Indiana, for stacking DRAM chips to make High Bandwidth Memory (HBM) chips for Nvidia GPUs — South Korean company's memory chips will be packaged with Nvidia processors to create more powerful AI products
advanced bandwidth build chip chips dram financial gpus hbm memory nvidia nvidia gpus packaging sk hynix
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