April 10, 2024, 4:45 a.m. | Ying-Lin Chen, Jacob Deforce, Vic De Ridder, Bappaditya Dey, Victor Blanco, Sandip Halder, Philippe Leray

cs.CV updates on arXiv.org arxiv.org

arXiv:2404.05862v1 Announce Type: new
Abstract: Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufacturing. To address this, suppliers are exploring thinner photoresists and new underlayers/hardmasks. These may suffer from poor SNR, complicating defect detection. Vision-based ML algorithms offer a promising solution for semiconductor defect inspection. However, developing a robust ML model across various image resolutions without explicit training remains a challenge for nano-scale defect …

abstract arxiv challenges cs.cv focus however industry low manufacturing nas pitch semiconductor technology type

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