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TSMC explores massive rectangular chip substrates to meet AI demand
June 21, 2024, 3:24 p.m. | Zo Ahmed
TechSpot www.techspot.com
The proposed rectangular substrate is currently undergoing trials. Measuring a substantial 510mm by 515mm, it reportedly boasts over three times the usable area of current round wafers. Additionally, the rectangular shape reduces wasted space around the edges. The study is still in the early stages, and its results may take...
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ai demand chip current demand massive measuring results shape space stages study tsmc
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