UMC launches W2W 3D IC Project with Partners, Targeting Edge AI Growth

Winbond, Faraday, ASE, and Cadence comprise project members to provide a one-stop platform for customers’ stacked silicon needs United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and...

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