Winbond introduced Innovative CUBE Architecture for Edge AI Devices

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases. The Company’s new customized ultra-bandwidth elements (CUBE) enable memory technology to be optimized for seamless performance running generative AI on hybrid edge/cloud applications. CUBE...

The post Winbond introduced Innovative CUBE Architecture for Edge AI Devices first appeared on AI-TechPark.

ai ai data analytics ai information ai learning aitech news ai technology ai technology companies applications architecture artificial intelligence artificial intelligence chatbot artificial intelligence robot bandwidth cases cloud cloud applications computing devices edge edge ai electronics enabling generative generative artificial intelligence global hybrid memory performance running semiconductor solutions technology use cases