Expect a Wave of Waferscale Computers

At TSMC’s North American Technology Symposium on Wednesday, the company detailed both its semiconductor technology and chip packaging technology roadmaps. While the former is key to keeping the traditional part of Moore’s Law going, the latter could accelerate a trend towards processors made from more and more silicon, leading quickly to systems the size of a full silicon wafer. Such a system, Tesla’s next generation Dojo training tile is already in production, TSMC says. And in 2027 the foundry plans …

advanced packaging cerebras chip chips act computers expect key law moores-law packaging part processors roadmaps semiconductor silicon silicon wafer systems technology the company trend tsmc wednesday while