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Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM 4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB - IEDM 2023
Jan. 3, 2024, 8:55 p.m. | Dylan Patel
SemiAnalysis www.semianalysis.com
amd applied materials array china cmos dram genai hbm hybrid innovation intel layer material materials micron modeling nand performance samsung sanctions sk hynix tsmc
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